Industrial and Automotive Grade 3D NAND e.MMC Series EM-30
■Key Benefits
●Designed and tested for robustness, reliability and integrity for both device and data
●Latest 3D NAND technology for reduced TCO over an extended product life cycle
●Boot area partitioning, RPMB, general purpose partitioning and user data area
●Extended cross temperature stability range from -40°C to 105 °C
●Compliant to AEC-Q100 Grade 2, IATF 16949 and ISO 27001
●Advanced firmware features to keep data and device safe in critical conditions
[ Embedded systems ][ PLCs ][ Automotive ][ Infotainment ][ ADAS,instrument cluster ][ video recording ][ EV charging ][ HMI/POS/POI terminals ][ Factory/industrial automation ][ Routers ][ switches ][ Things applications ][ Medical systems ] |
|
Supplier and Product Introduction |
|
|
|
Please see the document for details |
|
|
|
|
|
|
|
English Chinese Chinese and English Japanese |
|
2022/5/2 |
|
|
|
|
|
262 KB |
- +1 Like
- Add to Favorites
Recommend
- SMART Modular Introduces PCIe NVMe Flash Storage Products in M.2 Type 1620 BGA Package and M.2 2230 Module
- Renesas RA Family Mainstream 32-bit Microcontrollers: RA4M3, RA6M4, RA6M5 Group BGA Package Product Addition
- Compliant to JEDEC V5.1 Standard DuraFlask BGA E340 EMMC,provides s Stable, Yet Cost Effective High-density Embedded Storage
- Geehy Launches the First Industrial-grade High-performance MCU APM32F407IGH6 in BGA Package to Apply for Medical and High-end Consumer Electronics
- BGA SSD: Powerful NVMe Performance in a Tiny Package
- Introducing the RX MCU Product Longevity Program (PLP) That Goes beyond 15 Years of Support!
- eToF™ Laser Driver ICs for Advanced Autonomy Lidar
- GaN Transistor for Several Power Applications
All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.