Heat Exchangers for Today's Immersion Cooling Systems：Laird Thermal Systems Application Note
■Due to the increased amount of heat being generated in data centers and high-performance computing applications, traditional methods of air cooling are not meeting the thermal management requirements for today's servers, CPUs, and GPUs.
■Immersion cooling is the preferred method when it comes to heat dissipation and cooling of high-performance computing and cloud computing. Immersion cooling submerges the hardware into a heat-conducting dielectric liquid that recycles drawn out heat into cooler liquid. Utilizing heat exchangers, immersion cooling is an ideal method of bulk heat removal and temperature control for computer servers.
■The LA5000 is a compact heat exchanger system providing the high heat pumping capacity and reliability needed for immersion cooling applications.
|
Heat Exchangers 、 Liquid-to-Air Water Heat Exchanger 、 compact heat exchanger system |
|
|
Application note & Design Guide |
|
|
|
|
Please see the document for details |
|
|
|
|
|
|
|
|
|
|
|
English Chinese Chinese and English Japanese |
|
|
081222 |
|
|
|
|
|
|
|
|
840 KB |
- +1 Like
- Add to Favorites
Recommend
- Laird Thermal Systems‘ Next Generation Heat Exchanger LA5000 Economically Provides Full-Time Operation for Immersion Cooling in Data Centers
- Laird Thermal Systems Introduces 5000Watt Heat Exchanger for Industrial Applications
- Laird Thermal Systems Commits to Sustainable Principles with SBTi-Endorsed Emissions Goals
- PowerCycling PCX Elongated Thermoelectric Coolers from Laird Thermal Systems Speed up PCR Testing
- Laird Thermal Systems Unveils Micro Multistage Thermoelectric Cooler ＆ Optical TEAs Integration Capability
- Laird Thermal Systems‘ Nextreme™ Value Chillers Provide Economical, High Reliability OEM Cooling Solution
- Nextreme™ Value Chiller Family Provides Economical Cooling Solution for Manufacturers of Medical, Industrial and Analytical Equipment
- Laird Develops Micro Thermoelectric Cooler with Heat Pumping Densities up to 27W/cm² for Next Generation of Optoelectronic Packages
All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.
Integrated Circuits
Discrete Components
Connectors & Structural Components
Assembly UnitModules & Accessories
Power Supplies & Power Modules
Electronic Materials
Instrumentation & Test Kit
Electrical Tools & Materials
Mechatronics
Processing & Customization
