TMM® Laminates Data Sheet
■Wide range of dielectric constants
◆Ideal for single material systems on a wide variety of applications
■Exceptional mechanical properties
◆Resist creep and cold flow
■Coefficient of thermal expansion matched to copper
◆High reliability of plated through holes
■Resistant to process chemicals
◆Reduces damage to material during fabrication and assembly processes
■Thermoset resin
◆Reliable wirebonding
◆No specialized production techniques required
◆TMM10 and 10i laminates can replace alumina substrates
●TMM® thermoset microwave materials are ceramic, hydrocarbon, thermoset polymer composites designed for high plated-thru-hole reliability stripline and microstrip applications. TMM laminates are available in a wide range of dielectric constants and claddings.
●The electrical and mechanical properties of TMM laminates combine many of the benefits of both ceramic and traditional PTFE microwave circuit laminates, without requiring the specialized production techniques common to these materials. TMM laminates do not require a sodium napthanate treatment prior to electroless plating.
●TMM laminates have an exceptionally low thermal coefficient of dielectric constant, typically less than 30 ppm/°C. The material’s isotropic coefficients of thermal expansion, very closely matched to copper, allow for production of high reliability plated through holes, and low etch shrinkage values. Furthermore, the thermal conductivity of TMM laminates is approximately twice that of traditional PTFE/ceramic laminates, facilitating heat removal.
●TMM laminates are based on thermoset resins, and do not soften when heated. As a result, wire bonding of component leads to circuit traces can be performed without concerns of pad lifting or substrate deformation.
●TMM laminates combine many of the desirable features of ceramic substrates with the ease of soft substrate processing techniques. TMM laminates are available clad with 1/2 oz/ft2 to 2 oz/ ft2 electrodeposited copper foil, or bonded directly to brass or aluminum plates. Substrate thicknesses of 0.015” to 0.500” are available. The base substrate is resistant to etchants and solvents used in printed circuit production. Consequently, all common PWB processes can be used to produce TMM thermoset microwave materials.
|
[ RF circuitry ][ microwave circuitry ][ Power amplifiers ][ combiners ][ Filters ][ coupler ][ Satellite communication systems ][ Global Positioning Systems Antennas ][ Patch Antennas ][ Dielectric polarizers ][ lenses ][ Chip testers ] |
|
|
Datasheet |
|
|
|
|
Please see the document for details |
|
|
|
|
|
|
|
|
|
|
|
English Chinese Chinese and English Japanese |
|
|
080922 |
|
|
|
|
|
92-108 |
|
|
329 KB |
- +1 Like
- Add to Favorites
Recommend
- Rogers Announces Acquisition of Silicone Engineering
- Sekorm Became an Authorized Distributor of Rogers
- Rogers Announces Termination of Merger Agreement with DuPont
- Rogers Corporation Introduces New Water-Resistant Flexible Heater Substrate
- Rogers‘ Micro Channel Coolers (MCC) in High Performance Computing (HPC) Applications
- Air Cooled VCSEL Applications with Rogers Micro-Channel-Coolers (MCC)
- Rogers‘ Advanced Laminates Power The Mars Exploration of NASA
- Rogers developed Thermal Simulation Tools to Accelerate Time to Market
All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.
Integrated Circuits
Discrete Components
Connectors & Structural Components
Assembly UnitModules & Accessories
Power Supplies & Power Modules
Electronic Materials
Instrumentation & Test Kit
Electrical Tools & Materials
Mechatronics
Processing & Customization
