Certificate of Registration CORWIL Technology Corporation ISO 9001:2008 For Device Assembly: Wafer Thinning & Dicing, IC Device Assembly. For Integrated Circuits: Electrical Test, Burn-In, Environmental Test, Reliability Test, Lead Scan Test, Tape & Reel Services.
●This certifies that the Quality Management System of CORWIL Technology Corporation
●has been assessed by NSF-ISR and found to be in conformance to the following standard(s):ISO 9001:2008
●Scope of Registration:For Device Assembly: Wafer Thinning & Dicing, IC Device Assembly. For Integrated Circuits: Electrical Test, Burn-In, Environmental Test, Reliability Test, Lead Scan Test, Tape & Reel Services.
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Test Report |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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28-APR-2015 |
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C0171872-IS2 |
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1.2 MB |
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