Si100x Revision E-GM2
●Title: Si100x Revision E-GM2
●Description of Change:Silicon Labs is pleased to announce Revision E-GM2 of the Si100x devices and version 1.3 of the corresponding datasheet for these products.
The ground pad on the IC has been reduced to increase the distance between the outer edge of the pad and the pins on the device.
As of the PCN effective date, customers should begin to order Si100x-E-GM2 products.
●Reason for Change:Si100x Revision E-GM2 increases the distance between the ground pad and the pins on the package. The increased tolerance improves PCB manufacturability. The PCB land pattern and PCB solder stencil specified in the datasheet for the LGA-42 package is compatible with both E-GM and E-GM2 parts.
The datasheet includes updates to the LGA-42 package information to reflect the ground pad dimensions.
●Impact on Form, Fit, Function, Quality, Reliability:There is no change in form, function, quality or reliability.The PCB land pattern and PCB solder stencil specified in the datasheet for the LGA-42 package is compatible with both E-GM and E-GM2 parts. A PCB change is not necessary.
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Si100x 、 Si1000-E-GM 、 Si1000-E-GM2 、 Si1001-E-GM 、 Si1001-E-GM2 、 Si1002-E-GM 、 Si1002-E-GM2 、 Si1003-E-GM 、 Si1003-E-GM2 、 Si1004-E-GM 、 Si1004-E-GM2 、 Si1005-E-GM 、 Si1005-E-GM2 、 Si100x-E-GM2 |
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PCN/EOL |
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Please see the document for details |
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LGA-42 |
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English Chinese Chinese and English Japanese |
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3/25/2013 |
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Revision E |
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#1303251 |
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152 KB |
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