3D3D16G32WB2650 DDR3 Synchronous Dynamic Ram MEMORY MODULE DDR3 SDRam 512Mx32-FBGA
■3D Plus offers a new 16Gbit DDR3 SDRAM cube compatible with the industry standard footprint.
■This product embeds 2 chips with a capacity of 8Gb (512Mx16) each.
■Our products are available at 1066 and 1333 Mbps in Industrial and Military temperature range.
■Thanks to the high density patented tech no logy the memories are embedded in a small form factor device without compromising electrical or thermal performance.
■This device is ideal for high density memory applications that require high speed transfer and compatibility with standard servers and networking equipment.
●Features and Benefits:
■Industry standard ball-out
■Combines two 8Gbx16 devices in one package
■Vdd=VddQ = +1.5V
■Differential bidirectional data strobe
■8n-bit prefetch architecture
■8 internal banks per memory
■Nominal and dynamic on-die termination
■Programmable CAS latency
■Posted CAS additive latency
■Fixed burst lengths of 8 and burst chop (BC) of 4
■Selectable BC4 or BL8 on-the-fly
■Self refresh mode
■Write leveling
■Multipurpose register
■Output driver calibration
■Clock rate available : 1066 -1333 Mbps
■Industrial and Military temperature range.
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[ Embedded Systems ][ Workstations ][ Servers ][ Super Computers ][ Test Systems ] |
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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MAY 2016 |
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REV 0-5 |
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271 KB |
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