WP56DK Series 0.3mm Pitch, Stacking Type Board-to-board (FPC) Connector With Power Supply Terminals

2022-06-21
●In high-performance compact wearable devices such as smartwatches, the PCB found inside of the device is much smaller than those inside of smartphones, which requires components used in these devices to also be much smaller.
●While the overall device size is decreasing, the functions and features found in these devices continue to evolve and grow, further emphasizing the need for higher density components such as connectors.
●One of the key areas where connector density can be improved is by reducing the contact pitch. This allows more contacts to be housed in a smaller area, which will leave more board space for other components and modules.
●This product is the first JAE connector has a reduced contact pitch of 0.3mm compared to the standard 0.35mm pitch widely used in today’s electronics.
●This product adopts our standard multifunction hold-down structure which allows them to be used as a power supply terminal to reduce total pin count.
●The hold-downs also incorporate protective metal fittings which provide armoring on the mating and internal surfaces of the insulator for ultimate strength and reliability. Due to this structure, the connector has improved workability during the alignment and mating process.
●Features
■0.35mm pitch, 1.6m width, 2 rows, 0.6mm mated height
■2 power supply terminals supporting 3.0A each (Also serving as a hold-down)
■Hold-down structure adds protection to the top mating surface to prevent damage to the insulator (Armored)
■Improved workability for assembler with clear click feeling when fully mated
■2 point contact structure for reliable connection
■Nickel barrier on contact prevents solder wicking
■Supports MIPI, USB3.1 Gen2, PCIe Gen3 transmission

JAE

WP56DK SeriesWP56DKWP56DK-P***VA*-R****WP56DK-S***VA*-R****WP56DK-P******-R15000WP56DK-S******-R15000

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Part#

Board-to-board (FPC) ConnectorPlugReceptacle

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Smartwatches ]smartphones ]tablet PCs ]laptops ]digital cameras ]AR / VR headsets ]small mobile devices ]

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Datasheet

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Please see the document for details

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English Chinese Chinese and English Japanese

Sep.2020

MB-0364-1

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