3D3D16G72WB2768 DDR3 SDRAM MEMORY Datasheet
■The 3D3D16G72WB2768 is a highly integrated module operating as a DDR3 SDRAM 72b SO-DIMM in a BGA package. It is intended for use as main memory when installed in embedded systems.
■It offers a memory density of 16Gbitswith ECC on a 72 bits data bus in a single rank of 256Mbx72 high speed memory array. It is based on 5 dies achieving high speed double-data-rate transfer rates of up to 1333Mb/sec/pin for general applications. The module is designed to comply with the following key DDR3 SO-DIMM features: (1) posted CAS with additive latency, (2) write latency = read latency -1, (3) On Die Termination (4) programmable driver strength data, (5) seamless BL4 access.
■All the control and address inputs are synchronized with a pair of externally supplied differential clocks. Inputs are latched at the cross point of differential clocks (CK rising and CK#falling). All I/Os are synchronized with a pair of bidirectional differential data strobes (DQS and DQS#) in a source synchronous fashion. The address bus is used to convey row, column and bank address information in a RAS# and CAS# multiplexing style.
■The 16Gb DDR3 device operates with a single power supply: 1.5V VDD(or 1.35V in DDR3L mode).This device is ideal for high density memory applications that require high speed transfer and compatibility with standard processors, DSP or FPGAs.
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3D3D16G72WB2768 、 3D3D16G72WB2768 IB L 、 3D3D16G72WB2768 SB L 、 3D3D16G72WB2768 MB L |
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[ Embedded Systems ][ Single board computers ][ High performance computers ][ Test Systems ] |
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Datasheet |
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Please see the document for details |
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BGA;BGA 223 |
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English Chinese Chinese and English Japanese |
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APRIL 2021 |
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REV 3 |
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3DDS-0768 |
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816 KB |
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