EW 6311B One-part low temperature curing epoxy
●EW 6311B is a single part, solvent free hybrid material. It has excellent bonding strength to various substrates, and compatible with flux residue of solder paste. It is specially designed for FPC coating and component protection.
■Features:
●Excellent bonding strength to various substrates, such as glass, aluminum, stainless steel, FPC and PCB
●Either normal thermal curing or SMT reflow process curing
●Good dielectric property, low Dk and Df
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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10/11/2021 |
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Version 1 |
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735 KB |
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