EW 6501C One-part conductive die attach paste
■EW 6500C is a one-part, conductive hybrid die attach paste. The typical application is for die attach bonding where conductivity is required. It is widely used in the semiconductor industry.
●Features
■Recommended substrates: Au, PPF and Ag
■Excellent dispensability with minimal trailing and stringing
■High DSS and lower modules which provide robust MSL performance among wide range of die size
■Easy to apply in automatic or manual process dispensing.
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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07/2021 |
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Version 2 |
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682 KB |
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