LOCTITE ECCOBOND EN 3838T Technical Data Sheet
■ LOCTITE ECCOBOND EN 3838T provides the following product characteristics:
■ Technology: Epoxy
■ Appearance: Black liquid
■ Product Benefits:
▲ One component
▲ Thixotropic
▲ Fast cure at moderate temperatures
▲ Low Tg
▲ Low modulus
▲ Reworkable
▲ Pb-free applications
■ Cure: Heat cure
■ Application: Encapsulation
■ Typical Package Application: CSP and BGA
● LOCTITE ECCOBOND EN 3838T is designed to provide an flexible, low Tg material for encapsulating components on a PCB. When cured, this material provides physical protection and stable electronic performance and protection in temperature/humidity/bias testing.
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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September 2015 |
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66 KB |
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