LOCTITE® ECCOBOND EO1061 Technical Data Sheet
■ LOCTITE® ECCOBOND EO1061 provides the following product characteristics:
■ Technology: Epoxy
■ Appearance: Black
■ Product Benefits:
▲ High performance
▲ Medium flow
■ Filler Weight, %: 61.3
■ Components: One-component
■ Cure: Heat cure
■ Application: Encapsulation
■ Typical Applications: Chip-on-board and Low profile divices
● LOCTITE® ECCOBOND EO1061 is designed to pass 1,000 hours of temperature/humidity/bias testing and thermal cycling up to 125°C. Exceptional viscosity stability at 25°C provides easier control of shot size using conventional time/pressure dispensing equipment.
|
|
|
|
|
|
|
Datasheet |
|
|
|
|
Please see the document for details |
|
|
|
|
|
|
|
|
|
|
|
English Chinese Chinese and English Japanese |
|
|
November 2018 |
|
|
|
|
|
|
|
|
79 KB |
- +1 Like
- Add to Favorites
Recommend
All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.
Integrated Circuits
Discrete Components
Connectors & Structural Components
Assembly UnitModules & Accessories
Power Supplies & Power Modules
Electronic Materials
Instrumentation & Test Kit
Electrical Tools & Materials
Mechatronics
Processing & Customization
