LOCTITE ECCOBOND EN 3707F Technical Data Sheet
■ LOCTITE ECCOBOND EN 3707F provides the following product characteristics:
■ Technology: Epoxy
■ Appearance: Light yellow liquid
■ Product Benefits:
▲ Dual cure
▲ Fast UV cure
▲ One component
▲ Cures in shadowed areas with heat
▲ Easy dispensability without stringing
▲ Fluorescent under UV light
■ Cure: Ultraviolet (UV) light or Heat cure
■ Application: Encapsulant
■ Typical Assembly Applications: Local protection of WLCSP and BGA on circuit board
● LOCTITE ECCOBOND EN 3707F no flow encapsulant is designed for local circuit board protection. This adhesive cures in seconds when exposed to the appropriate intensity of UV light. In addition to light cure, this adhesive contains a secondary thermal cure initiator.
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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November 2012 |
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63 KB |
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