Comparison Between SA57 and SA306
■As of June 2010; both the SA306-IHZ and SA57-IHZ are transitioning to a new packaging form factor. As available product inventories are reduced, the SA306-IHZ can be used as a substitute for the SA57-IHZ. Both devices have been using an identical package and the pin designation assignments are shown in the figures below. In applications requiring the SA57, the SA306 is interchangeable as long as it is connected as indicated in the SA57 data sheet. Please refer to the SA57 data sheet and to the pin out table and block diagrams provided in this Tech Alert. The HQ package currently used by these ICs is being replaced by the HU or HR package. These devices provide thermal transfer through the heat slug. The heat slugs are available on either top side (HU) or bottom side (HR -SA306 only) providing for flexible heat sinking options. Refer to the data sheets for packaging details.
|
|
|
|
|
|
|
Supplier and Product Introduction |
|
|
|
|
Please see the document for details |
|
|
|
|
|
|
|
|
|
|
|
English Chinese Chinese and English Japanese |
|
|
2012/10/25 |
|
|
REV3 |
|
|
TA57-306 |
|
|
595 KB |
- +1 Like
- Add to Favorites
Recommend
All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.
Integrated Circuits
Discrete Components
Connectors & Structural Components
Assembly UnitModules & Accessories
Power Supplies & Power Modules
Electronic Materials
Instrumentation & Test Kit
Electrical Tools & Materials
Mechatronics
Processing & Customization
