MIL-STD-883 Tin/Nickel Plated Leads ISO9001 Qualification Summary
■The testing described below was made to qualify the use of a matte tin (150-300μ”）over nickel (50-l00μ”）underplate in the Apex PSIP package. The qualification plan is modeled after JEDEC standards JESD22A121 and JESD201. Some modifications were made to the long term high temperature testing conditions. Specifically, the packages were subjected to a high temperature (150C) and low humidity condition (less than 1%). Two separate lead configurations were used in the qualification, these being the standard straight lead (DP package) and the 90° bent lead (EE package). As these packages are not typically used in a SMT applications, it was determined that no pre-conditioning would be required. Production lots were processed through all standard manufacturing and inspection processes. From these production iots，three separate sample groups were randomly selected (8 devices/sample group). This gave a total of 96 leads (8x12 leads/device) to evaluate in each of the sample groups. The three sample groups were separately run through the following tests:
■Temperature Cycle: Modified Condition A. Temperature range: -40C to +85C for 1,000 cycles, with an interim inspection at 500 cycles.
■Ambient Temperature/Humidity Storage: 30 ± 2C and 60 ± 10% RH for 3,000 hours with interim inspections every 1,000 hours.
■High Temperature Storage: 150 ± 5C for 3,000 hours with interim inspections every 1, 000 hours.
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Test Report |
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Please see the document for details |
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PSIP |
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English Chinese Chinese and English Japanese |
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2018/1/5 |
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482 KB |
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