LOCTITE ECCOBOND UF 3513HF epoxy underfill encapsulant Technical Data Sheet
●LOCTITE ECCOBOND UF 3513HF provides the following product characteristics:
▲Technology：Epoxy
▲Appearance：Translucent, pale yellow liquid
▲Product Benefits：
◆Halogen-free
◆One component for easy processing
◆Fast cure at moderate temperatures
◆Good adhesion to a variety of substrates
◆Stable electrical performance in temperature humidity bias
▲Cure：Heat cure
▲Application：Underfill, Encapsulant
▲Typical Package Application：CSP/BGA Connector
■LOCTITE ECCOBOND UF 3513HF epoxy underfill encapsulant is designed for CSP and BGA applications It cures quickly at moderate temperatures to minimize stress to other components When cured, this material provides excellent mechanical and moisture resistant properties for protection of electronic components
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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June-2017 |
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66 KB |
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