LOCTITE ECCOBOND UF 3800 Technical Data Sheet
■ LOCTITE ECCOBOND UF 3800 provides the following product characteristics:
■ Technology: Epoxy
■ Appearance: Black liquid
■ Cure: Heat cure
■ Product Benefits:
▲ High Tg
▲ Reworkable
▲ One component
▲ Room temperature flow capability
▲ Fast cure at moderate temperatures
▲ Minimal stress on other components
▲ Compatible with most Pb-free and halogen-free solders
▲ Stable electrical performance in temperature humidity bias
■ Application: Underfill
■ Typical Package Application: Chip scale packages and BGA
● LOCTITE ECCOBOND UF 3800 reworkable epoxy underfill is designed for CSP and BGA applications. It cures quickly at moderate temperatures to minimize stress to other components, and when cured provides excellent mechanical stress protection for solder joints.
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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September 2012 |
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65 KB |
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