NS150-D1131-04 NANO SIM H1.50 CARD CONN(DIP) socket
●Material:
◆Housing: High Temperature Thermoplastic, (LCP)Color Black UL 94V-0
◆ Contact: Phosphor Bronze(C5210)
◆Cover: Stainless steel
●Plating:
◆ Contact terminal:
▼Contact area: Gold 1u" Min.
▼Solder area: Gold 0.8u" Min .
▼Underplating: Ni overall 50U” Min.
◆ Cover:
▼Underplating: Ni overall 30U” Min.
▼Solder area: Gold 0.8u" Min .
● Specification:
◆Current Rating :0.5A max.
◆Contact Resistance: 50 mOhms max
◆Insulation Resistance:1000 MOhms min./500VDC
◆Dielectric Withstanding Voltage: 500 V AC/1 minute
◆Operating Temperature: -25℃ to+85℃
◆Mating Cycles:5000 Insertions
●Product Compliant to RoHs Directive 2002/95/EC and ELV 2000/53/EC
●Part Must Comply Taisol HF WD-3-I-091 Specification.
●Recommending A Metal More Than 0.15mm Thick.
●Please Confirm Solderadility, If Use A Metal Mask Less Than 0.15mm Thick.
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Product Drawing |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2018.11.19 |
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REV.:C |
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D-NS150-D1131-04 |
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271 KB |
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