NS150-T1131-18 NANO SIM H1.5 CARD
■Material:
▲Housing: High Temperature Thermoplastic, (LCP S475)Color Black UL 94V-0
▲Contact: Phosphor Bronze (C5210R-H, T=0.08±0.01 mm)
▲Cover: SUS301-H T=0.15±0.03mm
■Plating:
▲Contact terminal:
◆Contact area: Gold 1u" Min.
◆Solder area: Gold 0.8u" Min .
◆Underplating: Ni overall 50U" Min.
▲Cover:
◆Underplating: Ni overall 30U" Min.
◆Solder area: Gold 0.8u" Min .
■Specification:
▲Current Rating: 0.5A max.
▲Contact Resistance: 50 mOhms max
▲Insulation Resistance: 1000 MOhms min./500VDC
▲Dielectric Withstanding Voltage: 500 V AC/1 minute
▲Operating Temperature: -40℃ to+85℃
▲Mating Cycles: 5000 Insertions
■Product Compliant to RoHs Directive 2002/95/EC and ELV 2000/53/EC
■Part Must Comply Taisol HF WD-3-I-091 Specification.
■Recommending A Metal More Than 0.15mm Thick.
◆Please Confirm Solderadility, If Use A Metal Mask Less Than 0.15mm Thick.
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Product Drawing |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2019.07.15 |
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REV.: A |
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D-NS150-T1131-18 |
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246 KB |
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