The Effect of Solder-Joint Temperature Rise on Ceramic-Ball-Grid Array to Board Interconnection Reliability: The Motorola PowerPC 603™ and PowerPC 604™ Microprocessors and MPC105 Bridge/Memory Controller

PublishTime：2021-11-24

To predict solder joint reliability of surface-mount technology, a key parameter is: the temperature rise above ambient at the solder joint, ∆T. In-situ field temperature measurements were taken for a range of computer platforms in an office environment, at the central-processing units. Printed-circuit boards (PCB) were not uniform, therefore only maximum temperature regions of the board were measured. These maximum temperatures revealed the mean to be less than 20°C above ambient (i.e.,∆T < 20°C) regardless of the power of the device. The largest ∆T measured in any system was less than 30°C above ambient.These temperature measurements of actual computer systems are in close agreement with IPC-SM-785. By utilizing the measured PCB temperature rise,solder joint fatigue life was calculated for the 21mm ceramic ball-grid-array (CBGA), the package for the PowerPC 603™ and PowerPC 604™ RISC microprocessors. For the MPC105 PCI Bridge/Memory Controller package, data from both the 21mm and 25mm CBGA, were used for the estimate . At an average on-off∆T of 20°C, the 21mm CBGA and the 21 x 25mm CBGA have an estimated fatigue life of over 25 years and over 20 years; respectively.

Brand of Product：	NXP
Part#：	MPC105 、 PowerPC 603 、 PowerPC 604 More Part#
Product Category：	Microprocessors 、 Bridge/Memory Controller More
Application：	More
Data Type：	Technical Documentation More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：	CBGA
Language：	English Chinese Chinese and English Japanese
Date of Creation：	2020/03/24
Version Number：
Data Encoding：
Data Size：	258 KB

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