SI10U(S) Advanced Higher Modulus Material For PKG Substrate
■Tg>270℃(DMA)，Td>400℃(5%loss,TGA)
■Higher Flexural Modulus
■LowerX,Y/Z-axis CTE
■Halogen-free compatible with lead-free processing
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[ eMMC ][ DRAM ][ AP ][ PA ][ Dual CM ][ Fingerprint ][ RF Module ] |
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2021/06/07 |
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CN-TDS-2012-01-SI10U(S)-SI10NB(S) |
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710 KB |
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