C10346-01 Multiband plasma-process monitor

2021-09-07
●C10346-01 is a multiband plasma process monitor designed for real-time, monitoring of wide spectrum.
●Monitoring Plasma (Emission Spectrum) in Real-Time.
●C10346-01 is a monitoring system to detect wide spectrum plasma emission during the process of etching, spattering and CVD in semiconductor manufacturing.
●With the various analysis functions, it can be used for setting up end-point detection conditions and automatic detection of etching and cleaning, estimation of plasma species and monitoring (plasma) contamination and abnormal discharges.
●Features:
■Simultaneous measurements of wide (plasma) spectrum
▲Captures wide spectrum (emission) from (plasma) radicals or ions.
▲C10346-01 : 200 nm to 950 nm
■Real-time plasma (emission) measurement
▲Continuously measures up to 15 000 spectra at an interval of 20 ms(50 ms with concurrent running of detection software)
■Highly accurate and reliable measurements
▲A high resolution spectrometer and a ultra-high sensitive photo detector are firmly locked in position to assure the acquisition of accurate spectrum and precise spectrum responsivity data through sharply focused plasma emission spectrum images.
■High-sensitivity detection in UV spectrum region
▲Detects the UV spectrum region from 200 nm with high sensitivity.
■Easy measurement using optical fibers
▲The equipped optical fiber can be easily attached to plasma chambers through a SMA connector widely used.
■Operation with multiple chambers
▲A single analysis unit can control up to four C10346-01 Multiband plasma-process monitor via a USB 2.0 interface.
■Data acquisition software
▲The data acquisition software stores the spectrum data into the database during plasma process. This stored data can then be used for spectrum data calculations.
■Optional software
▲High sensitive endpoint detection and real-time monitoring of process abnormality are achieved by creating ''detection model''.

HAMAMATSU

C10346-01U9046C7460

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Part#

Multiband plasma-process monitor

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Easy parameter evaluations to detect etching and cleaning endpoints ]Estimation of plasma species during process ]Automatic detection of etching and cleaning endpoints ]Impurity and abnormal discharge monitoring ]

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Datasheet

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OCT/2020

SSMS0031E07

1.9 MB

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