Microelectronics in Space:LEADER IN THE SCIENCE OF HI-REL SPACE MICROELECTRONICS
For 50 years, Teledyne Microelectronics has met the challenge with creative packaging solutions for today’s most demanding applications.
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Technical Documentation |
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Please see the document for details |
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WLP;CSP;SIP;MCM;MCA;BGA;CGA;COB;SMT |
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English Chinese Chinese and English Japanese |
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150930 |
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2.3 MB |
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