High Temperature Electronics
●Technical Capabilities
■High Temperature Electronic Packaging (–55°C to 250°C)
■RF Electrical Design
■Substrate and PCB Layout Design for HI–REL applications
■Custom Metal and Ceramic (HTCC, LTCC) Package Design
■Multi–layer Thick–Film Substrate Fabrication (Al2O3, AlN, BeO)
■Hybrid Microcircuit Assembly and Test in Class 10K clean room environment
■CSP, Flip Chip & BGA Component Mounting
■Hermetic Package Sealing for HI–REL applications (Projection, Seam and Cold welds)
■Bare Die Procurement and Handling
■Quartz BAW Resonator Design & Fabrication (Round, Strip and HFF Inverted Mesa configurations)
■SAW Wafer Fabrication in Class 100 clean room environment
■Wafer deep etching technology for Wafer Level Packaging
■Process and Test Equipment Design
■Environmental MIL–PRF Screening
■Custom Process Equipment Design
■Physical Design Modeling and Finite Element Analysis
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HM-4201-RTCM1 、 HM-4201-RTCM2 、 PX-702 、 PX-570 、 PX-420 、 PX-610 、 VX-708 、 VX-400 、 HX-171 、 HC35 、 TO-5 、 HC37 、 TO-8 、 HC43 、 HC49 、 XR-R 、 XR-U 、 XR-B 、 XR-A 、 XR-P 、 SM1 、 SQ580 、 32.768kHz XO |
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Crystal Oscillators 、 Packaged Quartz Crystals 、 Real Time Clocks 、 Electronic Module Products 、 High Temperature Crystal Oscillators 、 High Temperature Packaged Quartz Crystals |
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Datasheet |
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Please see the document for details |
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SMD |
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English Chinese Chinese and English Japanese |
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January 2017 |
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Rev 004 |
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1.7 MB |
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