Advantages of Vincotech's Power Modules with Press-fit Technology
■This application note describes the differences between a standard solder able pin and a Press-fit pin for Vincotech’s power modules. Press-fit technology affects the reliability of the interconnection between PCB and pin, as well as the assembly process and the PCB requirements. Furthermore additional test procedures to the qualification tests are described. At the end of this application note press-in and press-out tools are presented.
●Introduction
■The Press-fit pin technology is a solder-less connection method, which ensures reliable mechanical and electrical contact. The first Press-fit solutions were established in the early 1970’s. It was simply a pin with a rectangular, solid cross section. Driven into the round hole in the PCB, the four corners bit into the hole’s plating, thus forming a gas tight bond. This technology was published in 1984 for the first time as the standard DIN 41611-5 and follow-ups in the “IEC 60352-5 Solder-less connections – Part 5: Press-in connections – General requirements, test methods and practical guidance”.
■Nowadays modern Press-fit pins contain a compliant mechanism that allows plastic deformation when the pin enters the hole. This mechanism compresses as the pressing tool forces the contact into a PCB hole. This compliance compensates the whole size tolerance, helps to prevent damage the PCB, keeps spring force for long term and permits repairs. Press-fit pin insertion into the plated hole creates a highly reliable, well accepted, gas tight connection.
■Within the industry segment, like the drive, solar and UPS market, a demand for improved reliability can be observed. Especially increasing numbers of components and therefore interconnections require better reliability. On the other hand cost improvement pressure of the market raises the need to reduce costs. The aim was therefore to develop an interconnection technology that would eliminate the need of soldering the power module whilst maintaining the reliability standards and electrical capabilities of the solder pin. This would make the assembly process of the modules easier, faster, and in the whole, more cost-effective. Furthermore the target was to establish the exact same layouts as those of the solder modules.
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Application note & Design Guide |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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Jun. 2018 |
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Revision 6 |
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AN_2021-06_001_v06 |
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1.1 MB |
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