Planar X Series BOARD LEVEL CERAMIC BASED THICK FILM RF FILTER CAPABILITY
●Planar X Series compliments Smiths Interconnect’s broad portfolio of RF/Microwave components with bandpass, bandstop, lowpass and highpass configurations up to 30 GHz (Ku-Band) offering premium performance in a small package. The frequency of operation can be further extended with added material and process capabilities.
●Planar X Series leverages Smiths Interconnect’s existing thick film process technology on various dielectric substrates which are designed for use in harsh high-reliability environments. The small footprint, light weight and surface mountable configuration allow for high volume pick and place applications and are ideal for SATCOM, Radar and Broadcasting industries. In addition, Smiths Interconnect offers value added high-reliability test options providing assurance in mission critical defense and space applications.
●Regardless of the application, our internal processes and procedures help ensure that all filters are fully compliant to customers’ specifications
●Features and Benefits:
■Small form factor – Reduced PCB Footprint
■Light Weight – Reducing overall system mass in critical space applications
■Surface Mountable – Ideal solutions for Pick and Place Applications
■Robust Materials – Suitable for Harsh Environment
■Frequency Offerings up to 18 GHz – Suitable for a wide array of applications
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[ Transmit Modules ][ Receive Modules ][ Up Converters ][ Down Converters ][ Instrumentation ][ Satellite Communications ][ Radar ][ Broadcast ] |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2021/05/01 |
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Version 1.0 |
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609 KB |
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