Smiths Interconnect Announced Planar X Series of RF Filters with Highpass Configurations up to 18GHz (Ku Band)
Smiths Interconnect announced the introduction of its Planar X Series of RF filter solutions with bandpass, bandstop, lowpass, and highpass configurations up to 18GHz (Ku Band).
The Planar X Series is part of an overarching initiative that entails the creation of first-class board-level ceramic-based thick film RF Filters, designed and tested to support various applications markets.
Planar X Series
Leverages existing thick film process technology on various dielectric substrates which are designed for use in high-reliability environments, to provide a cost-effective solution.
The small footprint, lightweight, and surface mountable configuration allow for high volume pick and place applications and make Planar X Series ideal for SATCOM, Radar, and Broadcasting industries.
“Planar X Series complements our broad portfolio of RF and Microwave components with the latest technology in RF filters, offering premium performance in a small package,” says Paul Harris, Sales and Marketing VP at Smiths Interconnect. “The technology has proven reliable in the most demanding environments building upon years of high reliability as a supplier of quality board-level components. The addition of the planar filter technology is a natural progression to our existing RF filter product portfolio and Smiths Interconnect is excited to offer this capability in combination with value-added testing services”.
The Planar X Series Smiths Interconnect leverages existing thick film process technology on various dielectric substrates which are designed for use in high-reliability environments, to provide a cost-effective solution offering:
Compact size and lightweight, resulting in reduced overall system mass in critical space applications
Excellent rejection characteristics, providing best-in-class RF performance
Robust materials, suitable for harsh environment
Integration capabilities
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