The Max Clip System™
●The Max Clip System™ for discrete power semiconductors is a high performance, low cost thermal solution that eliminates mounting holes, screws, rivets, and the thermal inefficiency associated withusing loose hardware to attach components to a heat sink. This quick, robust attachment method saves on labor and hardware costs while increasing performance and design flexibility.
●The Max Clip System™ is also the most effective system for mounting power devices in packages thathave no mounting holes. Max Clips apply consistent optimum pressure at the center of the semicon-ductor, improving contact with the heat sink for better thermal performance and maximum compo-nent reliability. Aavid offers approximately 50 extrusion profiles that accept over 20 different Max Clipsto suit your application. The Max Clip SystemTMis designed to accommodate a variety of semiconductorpackages including TO-220, TO-218, TO-247, TO-3P, and packages without mounting holes like TO-262,TO-273, TO-274, and TO-251.
●Features and Benefits of The Max Clip System™ include:
■Optimizes thermal management of power transistors
■Provides mounting for discrete power devices with or without mounting holes
■Reduce labor costs by eliminating the need for drilled or tapped holes in heat sinks
■Allows flexibility for moving or changing devices
■Provides consistent mounting force for reduced thermal resistivity (over lifetime)
■Assembly costs using The Max Clip System™ are lower than with conventional hardware such as screws/nuts
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