Boyd anticipates exponential semiconductor power growth and continually develops innovative cooling solutions
Rise of Power: Increasing Power Demand for High-Performance Chips
The semiconductor industry continues to drive Moore’s Law and push the boundaries of semiconductor chip power and performance. Higher performance, more powerful and complex chips generate more heat with higher power densities. Thermal technology innovators like BOYD are developing new methods to cool exponentially rising chip power and performance.
New semiconductor technologies are driving increased cooling requirements
Chip power has nearly doubled in the last few years, with innovators going from 400 watts of cooling in 2020 to 750 watts in 2023. As power demands are projected to reach or exceed 1500 watts by 2025 for high performance applications, traditional liquid cooling may not be sufficient to effectively handle the increasing heat dissipation needs of these chips.
Rising chip power calls for innovative cooling technologies
Boyd’s Advanced Liquid Cooling: Pushing the Edge of Traditional Liquid Cooling
Overcome the anticipated thermal challenges from increasing power demands of high-performance chips with advanced liquid cooling technology that combines two-phase cooling and liquid cooling systems into pumped two-phase systems, or evaporative liquid cooling. Evaporative liquid cooling leverages the benefits of both cooling technologies to enable higher density electronics.
Boyd’s cooling technology heritage enables a strong foundation to innovate more effective and efficient cooling.
Innovate with Boyd: Efficiently Cool Next Generation Semiconductors
Boyd’s strong heritage of two-phase cooling like 3D vapor chambers and thermosiphons and liquid cooling system technologies such as coolant distribution units, liquid cold plates, and chillers enables us to explore new possibilities and develop advanced cooling solutions to effectively and efficiently cool chips further than 1600 watts. These chips are crucial for growing applications like Artificial Intelligence and Autonomous Computing in the cloud and eMobility industries.
Boyd’s development team is looking beyond the next few years of semiconductor development, so if your chip requirements exceed what you think is currently possible, please contact us. We may already be working on a solution.
Boyd anticipates exponential semiconductor power growth and continually develops innovative cooling solutions.
- +1 Like
- Add to Favorites
Recommend
- Laird Thermal Systems’ Prototyping Liquid Cooling Systems
- Aavid‘s Liquid Cooling Systems: Modular or fully customized liquid cooling optimized for improved heat dissipation in condensed volumes
- Laird Thermal Systems‘ Testing Liquid Cooling Systems Can Be Tailored According to Customer Specifications and Applicable Industry Standards
- Trend towards Liquid Cooling Systems
- Common Coolant Types and Their Uses in Liquid Cooling Systems
- Liquid to Liquid Ambient Cooling Systems for Semiconductor Tools
- Laird Thermal Systems Provides the Liquid Cooling Options for PET and SPECT Scanners
- Aavid‘s Modular Liquid Cooling Systems: Build a semi-custom system with high performance compatible components
This document is provided by Sekorm Platform for VIP exclusive service. The copyright is owned by Sekorm. Without authorization, any medias, websites or individual are not allowed to reprint. When authorizing the reprint, the link of www.sekorm.com must be indicated.
Integrated Circuits
Discrete Components
Connectors & Structural Components
Assembly UnitModules & Accessories
Power Supplies & Power Modules
Electronic Materials
Instrumentation & Test Kit
Electrical Tools & Materials
Mechatronics
Processing & Customization
