Increasing Thermal Challenges: Boyd and Innovative Cooling Technologies Enable the Development of Advanced Electronic Devices

PublishTime： 2023-09-01 Article Source：BOYD News

Rising Trend: Miniaturized Semiconductor Components

As semiconductor geometries continue to shrink, advances in microelectronics are driving the development of powerful, smart, and sophisticated devices. This ongoing miniaturization trend propels semiconductor innovation, enabling the scale-down of intricate patterns on wafers essential to produce advanced semiconductor devices.

Advanced Chipmaking Technologies: Pushing the Limits of Moore’s Law

Advancements in fabrication techniques, especially extreme ultraviolet (EUV) and deep ultraviolet (DUV) lithography, are revolutionizing the semiconductor manufacturing process, enabling increasingly miniaturized and efficient semiconductor components with significant improvements in transistor density, performance, and energy efficiency.

Extreme ultraviolet (EUV) lithography is a cutting-edge semiconductor fabrication technique that employs very short wavelengths of 13.5 nm, which is 14 times smaller than the other advanced lithography technique, deep ultraviolet (DUV) lithography with wavelengths of 193 nm. Such short wavelengths enable microchip circuit and transistor production at extremely small nodes, such as 7nm and 5nm, achieving unprecedented precision and resolution levels in semiconductor manufacturing.

Short wavelengths enable more transistors in a given chip size

By pushing the limits of possibilities in miniaturization and performance, these advanced techniques have pushed the boundaries of Moore’s Law. Moore’s Law predicted in 1965 that the number of transistors in an integrated circuit (IC) will double every two years until the technology reaches its miniaturization and performance limits.

Increasing Thermal Challenges: Need for Innovative Cooling Solutions

Extreme ultraviolet (EUV) and deep ultraviolet (DUV) lithography adoption has led to higher power densities which creates more heat in electronic components. Thermal management is a barrier to semiconductor innovation. More powerful, energy-efficient performance requires advanced cooling innovation.

More transistors in a smaller footprint means higher concentrations of heat

Semiconductor manufacturers continuously explore innovative cooling solutions such as liquid cooling, heat pipes, heat sinks, and advanced materials to dissipate growing heat levels from densely packed electronic components. Sustainable cooling innovation is required to unlock semiconductor technology’s fullest potential and enable continued advanced electronic device development.

Innovative thermal solutions enable the development of advanced electronic devices

BOYD and Innovative Cooling Technologies

Boyd has decades of experience and expertise innovating and manufacturing cooling solutions for semiconductors. Their customer-first service with market-leading speed and responsiveness combined with decades of semiconductor design expertise and robust, proprietary modeling tools enable us to iterate designs quickly and accelerate speed to market.

Boyd’s overlapping thermal technology portfolio enables liquid, two-phase, and air-cooling innovation to co-exist. Leverage their highly efficient, reliable, and sustainable liquid cooling systems to decrease test times, maximize temperature forcing range, or decrease chip operating temperature for faster processing and better uptimes.

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