201110822 Shipping Medium Change from tube to tray for Si823x, Si823Hx, Si827x
Silicon Labs is pleased to announce a change in shipping medium from tube to tray for the Si823x, Si823Hx and Si827x product families in RQFN package. The Minimum Order Quantity (MOQ) will be changed from 60 units/tube (Full Tube Qty) to 490units/tray (Full Tray Qty).
As of the effective date of the PCN, Silicon Labs will start to fulfill orders using the new shipping medium.
Reason for Change：
To standardize non-T&R packing material for RQFN package
|
Si823x 、 Si823Hx 、 Si827x 、 SI8273GA-IM1 、 SI8273GAD-IM1 、 SI8273AB-IM1 、 SI8273ABD-IM1 、 SI823H8CB-IM1 、 SI823H8BB-IM1 、 SI823H8AB-IM1 、 SI823H6CB-IM1 、 SI823H6BB-IM1 、 SI823H6AB-IM1 、 SI823H5CB-IM1 、 SI823H5BB-IM1 、 SI8275GB-IM1 、 SI8275GBD-IM1 、 SI8275GA-IM1 、 SI8275GAD-IM1 、 SI8275DB-IM1 、 SI8275DBD-IM1 、 SI8275DA-IM1 、 SI8275DAD-IM1 、 SI8275BB-IM1 、 SI8275BBD-IM1 、 SI8275AB-IM1 、 SI8275ABD-IM1 、 SI8274GB4D-IM1 、 SI8274GB1-IM1 、 SI8274GA1-IM1 、 SI8274GA1D-IM1 、 SI8274AB4D-IM1 、 SI8274AB1-IM1 、 SI8273GB-IM1 、 SI823H5AB-IM1 、 SI823H3CB-IM1 、 SI823H3BB-IM1 、 SI823H3AB-IM1 、 SI823H1CB-IM1 、 SI823H1BB-IM1 、 SI823H1AB-IM1 、 SI8235BB-D-IM1 、 SI8235AB-D-IM1 、 SI8234BB-D-IM1 、 SI8234AB-D-IM1 、 SI8233BB-D-IM1 、 SI8233AB-D-IM1 |
|
|
|
|
|
|
|
|
PCN/EOL |
|
|
|
|
Please see the document for details |
|
|
|
|
|
|
|
|
RQFN |
|
|
English Chinese Chinese and English Japanese |
|
|
11/10/2020 |
|
|
|
|
|
201110822;2020-11-10-822 |
|
|
731 KB |
- +1 Like
- Add to Favorites
Recommend
- Silicon Labs Launched New Si823Hx Gate Driver Board Optimized for High-power Modules
- Silicon Labs Strengthens Isolated Gate Driver Portfolio
- Silicon Labs Expands Isolated Gate Driver Product Family Ideal for Hybrid and Electric Vehicles (EV)
- Silicon Labs and Teledyne e2v HiRel Partner on High Reliability Isolation
- Silicon Labs Simplifies IoT Development with Simplicity Studio 5
- Software Speeds Development of IEEE 1588 System Integration | Silicon Labs
- News | Silicon Labs and Amazon Collaborate on Sidewalk, a New Shared Network for IoT Consumer Devices
- Silicon Labs and Skyworks reach agreement to sell infrastructure and automotive business
All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.
Integrated Circuits
Discrete Components
Connectors & Structural Components
Assembly UnitModules & Accessories
Power Supplies & Power Modules
Electronic Materials
Instrumentation & Test Kit
Electrical Tools & Materials
Mechatronics
Processing & Customization
