1KSMB Series 1000W Surface Mount TVS Diodes
2020-10-28
The 1KSMB series is designed specifically to protect sensitive electronic equipment from voltage transients induced by lightning and other transient voltage events.
Features:
• 1000W peak pulse power capability at 10/1000μs waveform, repetition rate (duty cycles):0.01%
• For surface mounted applications to optimize board space
• Low profile package
• Typical failure mode is short from over-specified voltage or current
• Whisker test is conducted based on JEDEC JESD201A per its table 4a and 4c
•IEC-61000-4-2 ESD 30kV(Air), 30kV (Contact)
•ESD protection of data lines in accordance with IEC 61000-4-2
• EFT protection of data lines in accordance with IEC 61000-4-4
• Built-in strain relief
•VBR @ TJ= VBR@25°C x (1+αT x (TJ - 25))(αT:Temperature Coefficient, typical value is 0.1%)
• Glass passivated chip junction
• Fast response time: typically less than 1.0ps from 0V to BV min
• Excellent clamping capability
•Low incremental surge resistance
•Typical I-R less than 1μA when V-BR max>12V
•High temperature to reflow soldering guaranteed: 260°C/40sec
•Plastic package is flammability rated V-0 per Underwriters Laboratories
• Meet MSL level1, per J-STD-020, LF maximun peak of 260°C
•Matte tin lead–free Plated
•Available in breakdown Voltage from 6.8V to 180V specially designed for automotive applications
•Offers high-surge rating in compact package: bridges the gap between 600W and 1.5KW
• Halogen free and RoHS compliant
• Pb-free E3 means 2nd level interconnect is Pb-free and the terminal finish material is tin(Sn) (IPC/JEDEC J-STD-609A.01)
Features:
• 1000W peak pulse power capability at 10/1000μs waveform, repetition rate (duty cycles):0.01%
• For surface mounted applications to optimize board space
• Low profile package
• Typical failure mode is short from over-specified voltage or current
• Whisker test is conducted based on JEDEC JESD201A per its table 4a and 4c
•IEC-61000-4-2 ESD 30kV(Air), 30kV (Contact)
•ESD protection of data lines in accordance with IEC 61000-4-2
• EFT protection of data lines in accordance with IEC 61000-4-4
• Built-in strain relief
•VBR @ TJ= VBR@25°C x (1+αT x (TJ - 25))(αT:Temperature Coefficient, typical value is 0.1%)
• Glass passivated chip junction
• Fast response time: typically less than 1.0ps from 0V to BV min
• Excellent clamping capability
•Low incremental surge resistance
•Typical I-R less than 1μA when V-BR max>12V
•High temperature to reflow soldering guaranteed: 260°C/40sec
•Plastic package is flammability rated V-0 per Underwriters Laboratories
• Meet MSL level1, per J-STD-020, LF maximun peak of 260°C
•Matte tin lead–free Plated
•Available in breakdown Voltage from 6.8V to 180V specially designed for automotive applications
•Offers high-surge rating in compact package: bridges the gap between 600W and 1.5KW
• Halogen free and RoHS compliant
• Pb-free E3 means 2nd level interconnect is Pb-free and the terminal finish material is tin(Sn) (IPC/JEDEC J-STD-609A.01)
- +1 Like
- Add to Favorites
Recommend
All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.
Integrated Circuits
Discrete Components
Connectors & Structural Components
Assembly UnitModules & Accessories
Power Supplies & Power Modules
Electronic Materials
Instrumentation & Test Kit
Electrical Tools & Materials
Mechatronics
Processing & Customization
