GOF3000 Thermal & EMI Gasket Graphite-Over-Foam w/ Cu Wrap and Silicone Foam
Laird’s Copper-over-Graphite-over-Foam (COGOF), GOF3000 thermal and EMI gasket, provides thermal transfer performance in the form of a traditional wrapped compressible foam gasket, and contains an outside copper wrap for electrical conductivity. GOF3000 combines the thermal transfer performance of the Tgon™ 9000 synthetic graphite outside wrap and the repeatable compression and rebound of the foam core. GOF3000 utilizes a silicone foam core for lower compression force and UL V0 flammability rating.
FEATURES AND BENEFITS:
•Electrical conductivity for EMI grounding.
•High deflection.
•Repeatable compression and rebound cycles.
•Good thermal conductivity between interfaces.
•Lightweight.
•Low force thermal interface.
•Abrasion resistant exterior.
•Ease of manufacturing for high volume.
•Meets environmental standards requirements.
•UL V0 flammability rating.
VALUE:
•Provides compressible thermal interface for sliding connections. Ideal for insertion applications..
•Ability to combine your EMI shielding and thermal management into one part.
•Ensures thermal interface contact in high movement locations that would separate a traditional thermal putty, gel, or grease.
•Offers lower force than traditional thermal interface pads for pressure sensitive applications.
•Improved reliability performance of electronics.
•Environmentally friendly solution meets including RoHS and REACH.
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Thermal & EMI Gasket 、 Graphite-Over-Foam w/ Cu Wrap and Silicone Foam |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2020/06/16 |
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311 KB |
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