New Rosenberger EBC® – Efficient Board Connector APPLICATION NOTE
It is almost twenty years since Rosenberger launched the original SMP (sub-miniature push-on) connector series. However, the RF Micro-wave industry is now entering an equally game changing era in RF connector design. While SMP sparked the ongoing adoption of Board-to-Board and Board-to-Module connection solutions, it is the imminent arrival of 5G which has proven to be the new disruptor in the RF Microwave industry.
This is leading to an exciting new wave of RF connector innovation. Manufacturers are striving to meet the increased performance demands of customers in many market sectors, none more so than those in Mobile Communications where op-erators are under pressure to deliver widespread roll-out of high-speed 5G from 2020, as quickly as possible, at the lowest possible cost.
Their ubiquitous high speed, low latency networks will be at the very heart of progressing future ad-vances in Artificial Intelligence (AI), The Internet of Things (IoT), Big Data analytics, Machine Learning, Connected Cars, Virtual Reality and much more. In fact, nobody really knows everything that 5G will deliver in the future. Being such a revolutionary technology, it is likely to be used to create services and applications we haven’t even imagined.
One thing is for sure, the stakes for more affordable, easy and reliable high speed RF connection sys-tems have never been higher. In response, Rosen-berger has developed the EBC® (Efficient Board Connector), a next generation Board-to-Board/Module RF interconnection system. This allows a low cost single design approach for multiple high performance applications and is fully optimized and future-proofed for 5G.
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Application note & Design Guide |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2020/04/02 |
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336 KB |
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