92ML(TM) Laminates and Prepregs
Corporation are specifi cally engineered and manufactured to meet the
demands of high power applications.
92ML™ materials are halogen-free, fl ame retardant, thermally conductive
epoxy based prepregs and laminates. They provide a low-cost, lead-free
solder compatible system with enhanced heat transfer characteristics.
These materials are ideal for multilayer applications requiring thermal
management throughout the entire board. The laminates are available
with up to 4oz copper cladding; thick enough to meet today’s most
demanding power distribution requirements. The high thermal
conductivity of up to 3.5 W/mK (in-plane) in combination with the
relative ease and familiarity of epoxy based systems makes this material
an ideal candidate for applications such as motor controllers, power
supplies, converters, automotive electronics, etc.
The relatively high Tg value of 160°C in combination with a low Z-axis
coeffi cient of thermal expansion of 22ppm/°C (
ensure that the 92ML™ materials survive lead free solder exposures and
board reliability testing. The excellent rheological characteristics of the
prepregs enable a high degree of resin fl ow; a critical element of high
power multi-layer board processing.
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[ Motor Controllers ][ Power Supplies ][ Converters ][ Automotive Electronics ][ LED Modules ][ Lighting ] |
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Datasheet |
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Halogen-free 、 Lead-Free 、 UL-94 V-0 |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2017/08/01 |
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PUB# 92-185 |
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298 KB |
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