Substrate Selection Can Simplify Thermal Management
●Heat haunts many RF/microwave and power electronics circuits and can limit performance and reliability. The heat generated by a circuit is a function of many factors, including input power, active device efficiencies, and losses through passive devices and transmission lines. It is often not practical to disperse heat from a circuit by convection fan-driven cooling, and heat must be removed from sensitive components and devices, by creating a thermal path to a metal enclosure or heat sink with good thermal conductivity.
●In many cases, however, such as miniature or multilayer electronic designs, it may not even be convenient or possible to attach a heat sink, and dissipation of excess heat must take place through the dielectric mate-rial of a printed circuit board (PCB) acting as a heat spreader, which can be accomplished through careful selection of circuit substrate materials. By using circuit materials formulated to dissipate heat, not only can circuit reliability be increased, but the power-handling capabilities of the circuits can be increased for the same or smaller-sized circuitry as standard circuit materials.
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Technical Documentation |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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NOVEMBER 2017 |
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2.8 MB |
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