electronica 2022: ITT Cannon Underlines its Commitment to Engineering Innovation and Sustainability

PublishTime： 2022-11-24 Article Source：ITT News

ITT Cannon was at Stand 125, Hall A2, at electronica from the 15th to 18th November.

IRVINE, Calif., November 10, 2022 – At electronica 2022, ITT Cannon showcased its latest product innovations and robust interconnect portfolio that provides reliability across multiple end markets, including aerospace, defense, medical, e-mobility, industrial, and transportation. In addition, the company highlighted key sustainability initiatives from manufacturing processes to products.

A sustainable future
With sustainability being the core theme for this year’s electronica trade fair and conference, amongst other technologies, ITT Cannon showcased their leading Electric Vehicle connector portfolio and new Tin Zinc J Plating technology, a fully VG (German military) qualified RoHS and REACH compliant cadmium replacement. “Looking to the future, ITT is rapidly moving forward with the implementation of a comprehensive environmental strategy, both product, and manufacturing. These objectives position ITT for continued success and growth in a sustainable manner,” says Ryan Flynn, ITT Senior Vice President & Connect and Control Technologies President.

expertise
“From highly engineered, custom-built interconnect solutions to off-the-shelf connectors, our strategic focus is to deliver the best possible customer experience and accelerating time to market,” states Ellen McMillan, Vice President and General Manager Europe, ITT Connect & Control Technologies. “electronica 2022 will give us the chance to connect with both new and existing customers and inform them about how our technology is bringing real differentiation.”

The advanced products being featured on the ITT Cannon stand will include:

The HDx™ Series: These high-density, small form factor connectors are robust and reliable, with both power and data transfer being supported. With watertight sealing up to 20meters and +5000 mating cycle resilience, they comply with high-speed communication protocols, such as USB® 3.1 Gen1 (up to 5Gbit/s data rates), 10Gbit/s Ethernet and HDMI® (up to 8.16Gbit/s). Watertight sealing enables deployment at depths up to 20 meters is exhibited plus +5000 mating cycle resilience.

The MKJ Series: This series of miniature circular connectors enable high-speed data transmission in mission-critical applications while achieving significant size and weight reductions. There are six different coupling options available (UNC thread, double start, triple start, bayonet, breakaway, and clip lock latching) for greater design flexibility. To support European customers, MKJ production will imminently begin in Europe to complement existing production in the Americas.

The APD Series: This full plastic harsh environment series provides proven, cost-effective, and high-quality interconnect solutions for modern industrial applications. Available in 1 to 51-way variants, this highly customizable solution is ideal for heavy and off-road vehicle applications.

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