ITT Cannon HDx™ Series High-Density, Ultra-Reliable Small Form Factor Interconnect Solution

PublishTime：2023-09-04

●ITT Cannon’s HDx™ Series offers a reliable, small form factor (SFF) solution in a lightweight, compact design. With breakaway or screw-lock breakaway coupling options, this high-density interconnect enables critical USB, HDMI or Ethernet high speed data transmission.
●Cannon’s HDx Series comes in an anti-glare, non-reflective Ruthenium plating and is rated up to 20 meter sealing depth when mated. This combined with it’s high durability rating, provide end users with a dependable interconnect system in any mission critical situation.
●Features & Benefits
■Lightweight, compact design
■Ultra-high density layouts
■Support signal & power
■Support high speed data
▲USB® 3.1 Gen1 up to 5Gbit/s
▲Ethernet up to 10Gbit/s
▲HDMI® up to 8.16 Gbit/s
■Watertight to 20 meter depth
■High-durability - +5000 mating cycles
■Anti-glare, non-reflective plating
■Break-Away or Threaded Locking Options

Brand of Product：	ITT
Part#：	HDx™ Series 、 HDx™ 、 HDx Series 、 HDx 、 HDX-WA1M0-09XMA More Part#
Product Category：	More
Application：	More
Data Type：	Datasheet More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：
Language：	English Chinese Chinese and English Japanese
Date of Creation：	08092022
Version Number：
Data Encoding：
Data Size：	1.8 MB

Data section preview(2pages)

- The full preview is over,the data is 2 pages -

Download

+1 Like
Add to Favorites

Recommend

Technical Resources

More>

All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.

Integrated Circuits