ITT Cannon HDx™ Series High-Density, Ultra-Reliable Small Form Factor Interconnect Solution

PublishTime：2023-10-20

●ITT Cannon’s HDx™ Series offers a reliable, small form factor (SFF) solution in a lightweight, compact design. With breakaway or screw-lock breakaway coupling options, this high-density interconnect enables critical USB, HDMI or Ethernet high speed data transmission.
●Cannon’s HDx™ Series comes in an anti-glare, non-reflective Ruthenium plating and is rated up to 20 meter sealing depth when mated. This combined with it’s high durability rating, provide end users with a dependable interconnect system in any mission critical situation.
●Features & Benefits
■Lightweight, compact design
■Ultra-high density layouts
■Support signal and power
■Support high speed data
▲USB® 3.1 Gen2 up to 5Gbit/s
▲Ethernet up to 10Gbit/s
▲HDMI® up to 8.16Gbit/s
■Watertight to 20 meter depth
■High durability: +5000 mating cycles
■Anti-glare, non-reflective plating
■Breakaway or threaded locking options

Brand of Product：	ITT
Part#：	HDx™ Series 、 HDx™ 、 HDX-WA1M0-09XMA More Part#
Product Category：	connectors More
Application：	More
Data Type：	Solutions More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：
Language：	English Chinese Chinese and English Japanese
Date of Creation：	10/2023
Version Number：
Data Encoding：
Data Size：	2 MB

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