MeiG Smart Released Wi-Fi 6 Module Adopting Qualcomm‘s Latest Generation QCA6391 Wi-Fi Chipset
Wi-Fi 6 has overcome the challenges of large bandwidth, large capacity and low latency in indoor coverage, and can support key applications such as VR, 4K/8K HD. Therefore, for specific scenarios, Wi-Fi 6 and 5G network can cooperate with each other to achieve the best cost performance of the entire access system. In the enhanced mobile broadband (eMBB) scenario, 5G CPE/MiFi products can be connected to 5G network to realize Internet connection, and 5G can be converted into Wi-Fi 6 signals to provide Internet connection services for more indoor devices without upgrading all devices to 5G. Meanwhile, since Wi-Fi 6 is of downward compatibility, devices with Wi-Fi 5 and below can also be connected to network communication through 5G network. What’s more, for outdoor high-density places with high flow rate (such as squares, gymnasiums and Hajj Day in Mecca), the capacity of 5G network may not meet the demand of users' access without adding 5G base stations, thus combining Wi-Fi 6 can be a cost-effective way to solve the problem.
In order to promote the rapid development of 5G industry and meet the needs of different industries for Wi-Fi 6 products, MEIG Smart has released SLM171 Wi-Fi 6 module, which adopts Qualcomm's latest generation QCA6391 Wi-Fi chipset and can support the latest Wi-Fi 6 standard, with downward compatibility of Wi-Fi 5 and Wi-Fi 4 standards and the size of 21.5 x 19.5 x 2.1 mm. QCA6391 chip adopts more advanced Dual MAC structure, which can support simultaneous operation of 2.4GHz and 5GHz frequency bands and simultaneous access of up to 32 users with a maximum rate of 1800 Mbps (2x280 MHz 11AX+2x40 MHz 11AXDBS). In addition, it can support uplink and downlink MU-MIMO, OFDMA, TWT (target wake-up time), BSS Coloring and other new technologies. While increasing the uplink and downlink rates, it can effectively improve the efficiency of multi-user access and reduce the time delay. Besides, it can effectively save the power consumption of Wi-Fi products with batteries and improve user experience.
MeiG SLM171 module can be used in conjunction with 5G module SRM815 to quickly build 5G terminals like MiFi, CPE, providing convenient 5G access for various customers. It has high cost performance and can help customers reduce research and development costs.
Through joint efforts with several CPE partners, 5G SRM815 module has successfully completed software and hardware adaptation with hard AP platforms such as Qualcomm IPQ807X/IPQ60XX, MediaTek MT7621 and Broadcom BCM6755, which can support PCIe 3.0 or USB3.0 and realize high-speed data transmission from 5G to Wi-Fi 6.
- +1 Like
- Add to Favorites
Recommend
- MeiG SLM500Q Smart Module Acquired Global Certifications including CCC/RoHS/CE and so on
- MeiG Rolls Out 5G RedCap Series FWA Solutions with Low Power Consumption and Low Cost
- MeiG Releases New 5G-A Module and FWA Solution, Bringing 5.5G into Reality
- MeiG Gives it‘s SLM750 LTE Cat.4 Module Core Advantages to Ship Worldwide
- Global Debut: MeiG officially launches 5G SRM900 series
- MeiG‘s SLM750 M2M Communication Module Successfully Passed the Certification of Three Authoritative Operators in Japan
- MeiG Released World’s First 5G-A FWA Solution, Providing Users Worldwide with Superior Experience
- MeiG Smart 5G Products Accelerate The Application of Industrial Internet Innovation
This document is provided by Sekorm Platform for VIP exclusive service. The copyright is owned by Sekorm. Without authorization, any medias, websites or individual are not allowed to reprint. When authorizing the reprint, the link of www.sekorm.com must be indicated.
Integrated Circuits
Discrete Components
Connectors & Structural Components
Assembly UnitModules & Accessories
Power Supplies & Power Modules
Electronic Materials
Instrumentation & Test Kit
Electrical Tools & Materials
Mechatronics
Processing & Customization
