InvenSense Announces Virtual Reality Display Inertial Sensor ICM-20603 Targeting for AR/VR/HMD Applications
InvenSense, a leading provider of MEMS sensor platform solutions, announced the ICM-20603, a 6-axis inertial sensor targeted for Augmented Reality/Virtual Reality/Head Mounted Display (AR/VR/HMD) applications. AR/VR/HMD and 3D audio headsets are primed for vast growth within the next few years (IHS reports 52% CAGR). Consumers are showing great interest in highly immersive experiences with media and content targeted for gaming, movies, 3D music, shopping, education, professional training, and real estate. The InvenSense ICM-20603’s performance delivers on that promise with best-in-class gyroscope stability vs. time and temperature, coupled with proprietary integrated technology for real-time response and content synchronization. These proprietary technologies which allow faster refresh rates on video, and tighter alignment of head-tracking motion with content, are essential to creating immersive experiences that avoid user discomforts such as eye stress, headache, and nausea.
In addition, the ICM-20603 Virtual Reality Display Inertial Sensor comes with a compatible 1KHz 9-axis sensor fusion library and software to create a platform for compelling new sensor-rich VR devices.
“Virtual Reality devices are growing at a rapid pace, with opportunity for additional sensor content in the Head Mounted Display and accompanying accessories,” said Eitan Medina, vice president of marketing and product management at InvenSense. “This presents an exciting opportunity for InvenSense which is leading the competition in meeting the rigorous performance demands of this market segment and delivering an exceptional user experience.”
- 【Datasheet】ICM-20603 High Performance 6-Axis MEMS MotionTracking™ Device
- 【Datasheet】ICM-20603 High Performance 6-Axis MEMS MotionTracking™ Device for AR/VR Applications with 1KHz 9-axis Sensor Fusion Library
- +1 Like
- Add to Favorites
Recommend
- TDK Announces the InvenSense ICP-10125 Waterproof SmartPressure™ Sensor Platform, Achieving the Industry’s Lowest Pressure Noise of 0.4 Pa RMS
- TDK Launches InvenSense Sensor Partner Program to Empower IoT innovation with Sensor Technology
- InvenSense® Provides High-Accuracy Turn-By-Turn Navigation User Experience To HiSilicon Mobile Platforms and Huawei Smartphones
- TDK’s New SmartMotion® Platform Accelerates Development of IOT Solutions Based on Invensense Motion Sensors
- InvenSense® Announces UltraPrint™ Mass-Manufacturable Ultrasound Fingerprint Touch Sensor Solution
- InvenSense® Ushers in the Era of Sensor System-On-Chip With the World’s First Integrated Motion Sensor and Multi-Core Processing
- InvenSense® Announces Contextual Awareness SDK for Embedded Developers and Mobile Devices
- InvenSense And AutoNavi Partner To Provide High-Accuracy, High-Availability Turn-By-Turn Navigation User Experience To Huawei Smartphones
This document is provided by Sekorm Platform for VIP exclusive service. The copyright is owned by Sekorm. Without authorization, any medias, websites or individual are not allowed to reprint. When authorizing the reprint, the link of www.sekorm.com must be indicated.
Integrated Circuits
Discrete Components
Connectors & Structural Components
Assembly UnitModules & Accessories
Power Supplies & Power Modules
Electronic Materials
Instrumentation & Test Kit
Electrical Tools & Materials
Mechatronics
Processing & Customization
