Rhyton 10W One-part Thermal Gel HiGel9000LV, with High Thermal Conductivity, Low Volatility and Anti-Sagging Resistance
With the continuous advancement of technology, the performance and complexity of equipment have also increased, and heat dissipation problems have become more and more prominent. As an efficient and environmentally friendly thermal interface material, thermal gel with excellent thermal conductivity, good touch Denaturation and ease of operation, is becoming an ideal choice for cooling ultra-high heat density equipment.
Thermal gel is generally filled between high-power heating devices and radiators or metal casings. By effectively filling uneven and irregular micro gaps between devices, it eliminates the air, greatly reduces the overall interface thermal resistance, makes the heating device work more efficiently, and quickly transfers the heat generated to the external environment, thereby reducing the operating temperature of the equipment and improving equipment performance.
HiGel9000LV series is a one-part thermal gel independently developed by Rhyton whose thermal conductivity reaches 10.0W/m·K.
Rhyton's R&D team has specially designed the resin and powder system so that HiGel9000LV has excellent properties such as high thermal conductivity, low volatility, and anti-sagging resistance. It can also resist powder settlement and low oil bleeding during long-term storage.
Therefore, HiGel9000LV is particularly suitable for applications that require materials have high thermal conductivity, high flow rate, small-volume dispensing, and low precipitation of small molecules. At present, it has been recognized by domestic mainstream customers in the fields of optical communications, 5G, consumer electronics and other fields.
Product characteristics:
High thermal conductivity, low thermal resistance
High flow rate, fast and smooth dispensing
Low volatility, low oil bleeding
Stable viscosity, no sagging
Low stress, good compressibility
Applicable fields:
Communication equipment, data centers, optical modules, LED chips, new energy vehicles, consumer electronics, medical equipment, military, aerospace.
Product Performance:
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