TE Connectivity Expands VITA 66 Optical Backplane Interconnect Product Family
HARRISBURG, Pa. JUNE 28, 2024 – TE Connectivity (TE), a world leader in connectivity and sensors, has expanded its VITA 66 optical backplane interconnect family with the new VITA 66.5 Style D optical modules. These high-density modules provide a rugged, blind-mate optical interconnect solution for aerospace, defense, and marine applications.
The VITA 66.5 Style D optical modules feature up to 3 MT ferrules per
insert and a floating receptacle design for optimal alignment.
Available in full-size and half-size configurations, they offer
versatility for various system designs. The modules are designed to
withstand harsh environments and meet military and aerospace
specifications.
"The VITA 66.5 Style D, 3 MT optical modules address the growing need for higher data rates and bandwidth in embedded computing applications," said Anders Thelin, Product Manager at TE Connectivity. "This expansion of our VITA 66 family demonstrates our commitment to providing advanced connectivity solutions for challenging environments."
Key benefits of the VITA 66.5 Style D, 3 MT optical modules include:
●Easy integration with common mounting interfaces for 3U and 6U VPX applications
●Rugged design based on proven optical termini for various applications
●High performance with up to 3 MT ferrules per insert and floating alignment capability
The VITA 66.5 Style D, 3 MT optical modules are suitable for applications such as embedded computing, secure communications, avionics, radar and imaging systems.
- +1 Like
- Add to Favorites
Recommend
- TE Connectivity Launches VITA 87 High Density Circular MT Connectors, Offering Higher Density for Next-Generation Embedded Systems
- TE Connectivity introduces the NanoRF Edge Launch connector for VITA 67.3 applications
- TE Connectivity to acquire antennas business from Laird Connectivity
- Wind Farms On-and Off-shore Reduces Installation Time with TE Connectivity’s New Easy-to-use High Voltage Joints (PHVJ)
- TE Connectivity Acquires Smart Grid Company Kries, Expanding TE’s Smart Grid Monitoring, Protection, Automation Capabilities
- TE Connectivity‘s Raychem USB 3.1 cable provides up to 10 Gb/s data rates and Jacket elongation of 200% minimum
- TE Connectivity and Sekorm Reached A Strategic Cooperation on the Connector Business
- TE Connectivity Acquires ERNI Group AG
This document is provided by Sekorm Platform for VIP exclusive service. The copyright is owned by Sekorm. Without authorization, any medias, websites or individual are not allowed to reprint. When authorizing the reprint, the link of www.sekorm.com must be indicated.
Integrated Circuits
Discrete Components
Connectors & Structural Components
Assembly UnitModules & Accessories
Power Supplies & Power Modules
Electronic Materials
Instrumentation & Test Kit
Electrical Tools & Materials
Mechatronics
Processing & Customization
