Heat Pipes for Power Control Case Study
Power Control Challenge
A manufacturer of industrial appliances had a new power
conditioning and control system with very limited heat sink space
available. The new system had three high power IGBT’s in close proximity
with a small thermal window due to a 50℃ max ambient temperature
condition. To compound the complexity of the project, there was a
transient condition to the system that would double the power for 1
minute every 10 minutes. BOYD, had assisted many other projects with
similar form factors although not with this level of power.
The
cabinet that housed the heat sink had two fans for forced convection
but the airflow was shared with another heat sink to cool an SCR.
Although the heat sinks were fully ducted to force all of the available
air through them, the top of the system was obstructed by baffling the
restricted 65% of the airflow. The new heat sink design would need to
mind the difficult balance of airflow vs pressure drop through the
entire cabinet.
Solution
Similar applications in the past had been addressed by Boyd
with extruded solutions but with this high power the fin density of an
extrusion was not going to cut it. A bonded fin approach with higher fin
density was adopted to increase the surface area for heat transfer. The
next performance enhancement was to spread the power throughout as much
of the base as possible to lower the temperature of the localized hot
spots. Using multiple heat pipes under each IGBT, the effective
footprint of each device was increased. This made it easier for heat to
get into the fins that were not directly over the IGBT’s.
The heat pipes embedded in the base helped to meet the thermal requirements for the 9 minute steady state but the performance was still lacking for the double power 1 minutes transient state. To give the heat sink a performance bump, heat pipes were run from the top of the base and then in through the middle of the fins. By transporting heat to the middle of the fins, the fin tips furthest from the base became more effective.
Following extensive thermal CFD design work, prototypes were built and tested with passing results. This design is now in successful mass production.
The end result was a very efficient heat sink that took up no more volume than a typical extruded or plain bonded fin heat sink.
- +1 Like
- Add to Favorites
Recommend
- How to Maintain the Heat Sink?
- Heat Sink Selection and Mechanical Criteria
- How To Select A Suitable Heat Sink To Effectively Increase The Mass And Surface Area Of Their Heat-dissipating Junctions
- The Function of Cleanness for the Heat Sink and Fan
- Boyd’s Solution Including a Counter Intuitive Reduction of Heat Sink Size Solved Customer’s Tablet Temperature Problem
- What is a Heat Sink Radiator: Unveiling the Secret of Efficient Heat Dissipation
- Surface Mount Resistors with Outrigger Heat Sink
- What Materials Are Used for Heat Sinks?
This document is provided by Sekorm Platform for VIP exclusive service. The copyright is owned by Sekorm. Without authorization, any medias, websites or individual are not allowed to reprint. When authorizing the reprint, the link of www.sekorm.com must be indicated.