TDK’s Next-generation Ultrasonic Time-of-flight Sensor Enables New Mass Market Applications in IoT and Robotics

PublishTime： 2024-04-11 Article Source：TDK InvenSense News

The InvenSense SmartSonic™ ICU-10201 high-performance ultrasonic ToF sensor has a powerful embedded processor and extended memory space, allowing complete application algorithms on the chip
Ideal for IoT and robotics applications, the MEMS sensor provides accuracy required for obstacle avoidance, soft surface identification, and liquid level measurements
ICU-10201 is now fully available at multiple distributors worldwide

TDK Corporation (TSE:6762) announces full distribution availability of its InvenSense SmartSonic™ ICU-10201 ultrasonic time-of-flight (ToF) sensor with on-chip processing, enabling the design of high-performance, low-power IoT and robotics products. The ICU-10201 sensor offers the sensitivity required for accurate obstacle avoidance or proximity sensing, which is used frequently in robotics, drones, and robot vacuum cleaner (RVC) devices. It is also highly relevant for products that require level sensing, such as in a liquid dispenser or coffee machine.

Key features and advantages of the ICU-10201 ultrasonic ToF sensor include:

Ultra-low power consumption in a miniature package: The SmartSonic family of ToF sensors integrate a MEMS piezoelectric micromachined ultrasonic transducer (PMUT) with a low-power system on chip (SoC) in an ultra-compact reflowable package.
Enhanced on-chip processing capabilities: The ICU-10201 embeds a powerful on-chip processor with higher computational power than previous solutions. Its enhanced processing capabilities allow fitting and running a wide range of application algorithms on-chip, offloading the system MCU completely.
High sensitivity: Based on ultrasonic pulse-echo or pitch-catch measurements, the ToF sensor provides millimeter-accurate and robust range measurements to targets at distances up to 1.7m, in any lighting condition including full sunlight, independently of the target’s color and optical transparency, like glass walls or mirrors.

“Our ICU-10201 allows the design of smarter low-power solutions, making the final product greener, safer, and more aware of surrounding environments,” said Massimo Mascotto, Director of Product Marketing, InvenSense, a TDK group company. “The sensor’s improved on-chip processing has greater computing power in a miniature package, which enables smarter products for our customers and partners.”

The ICU-10201 is available in an ultra-compact package footprint of 3.5 x 3.5mm².

Glossary

ToF: Time of flight
FoV: Field of view
MCU: Microcontroller unit
MEMS: Micro-electro-mechanical systems
PMUT: Piezoelectric micromachined ultrasonic transducer
RVC: Robot vacuum cleaner

Main applications

Obstacle avoidance for robotics and drones
Liquid level measurements for liquid dispenser and coffee machine
Surface composition/softness and cliff detection for robot vacuum cleaners

Main features and benefits

Second generation
Ultra-low power
Compact size; miniature ultrasonic sensor
Wide operating range from 3 cm to 1.7 m
Works in any lighting condition
Detects objects of any color and optical transparency
Customizable field of view (FoV) up to 180°
3.5 mm x 3.5 mm x 1.26 mm, 8-pin LGA package

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