Characteristics of Chip Fuses
With the development of technology, there are more and more components in circuit design, so the requirements for electronic component packaging are becoming smaller and smaller. The 0603 SMD fuse emerged in this context.
The 0603 chip fuse provides ultra-fast action fusing characteristics in a smaller chip size. The rated current value of the device is up to 4.0A, and its breaking capacity is 35A at a rated voltage of 32V.
The 0603 fuse adopts standard metric dimensions (91.55 mm x 85 mm x 45 mm) and can provide secondary overcurrent protection for low-voltage power supplies in DC-DC converters, battery chargers, and portable consumer electronic devices. Through strictly controlled manufacturing processes and advanced thick film technology, fuses provide eXCellent long-term stable fusing characteristics for portable devices such as mobile phones, PDAs, digital cameras, cameras, and LCD flat panel displays.
The halogen-free and lead-free 0603 chip self-recovery fuse supports lead-free soldering and can be processed on automatic SMD assembly systems using wave soldering, reflow soldering, or gas phase processes. The coating of the fuse can protect the device from dangerous electrical, mechanical, and climatic conditions.
Fig.1
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