SMART‘s DuraFlash RU350 Enterprise USBs are Offered with Triple-Level Cell (TLC) 3D NAND Flash
SMART's DuraFlash RU350 USB Flash drives provide low power, high capacity mass storage for embedded applications. RU350 USB Flash drives use an injection molding process to fit the smallest form factor requirements. They also provide enhanced reliability by incorporating onboard error detection and correction, and static and dynamic wear-leveling algorithms that provide reliable operation over a product’s life.
RU350 USB Flash drives are offered with Triple-Level Cell (TLC) 3D NAND Flash in capacities of 16GB to 256GB. The USB Flash drives comply with the Super Speed USB 3.0 interface and are backwards compatible with USB 2.0.
Features & Benefits
• Compliant with Super Speed USB 3.0
• I-Temp (-40°C to +85°C)
• LDPC Error Correcting Code
• Low Power Dissipation
• Small Form Factor
Applications
• Gaming
• IIoT
• Industrial
• Transportation
Product Family Overview
Specifications
- 【Datasheet】RU350 | USB 3.0 | USB Flash Drive
- 【Datasheet】RU350 | USB 3.0 | USB Flash Drive
- 【Datasheet】RU350 | USB 3.0 | USB Flash Drive
- 【Datasheet】DuraFlash™ RU350 | USB 3.2 | USB Flash Drive
- 【Datasheet】RU350 | USB 3.2 | USB Flash Drive
- 【Datasheet】DuraFlash RU350 USB Flash Drive Product Brief
- +1 Like
- Add to Favorites
Recommend
- SMART Modular Technologies to Present at SNIA Persistent Memory + Computational Storage Summit
- SMART Modular Announces the SMART Kestral PCIe Optane Memory Add-in-Card to Enable Memory Expansion and Acceleration
- SMART‘s DDR4 Modules Range From 32GB To 4GB, 20% Lower Overall Power Vs. DDR3
- SMART Modular Technologies Announces Next Generation of ME2 Flash
- SMART New SSD Solutions Are Ideally-suited for Government and High-security Applications
- SMART Announces SMART Zefr Memory with Ultra-High Reliability Performance for Demanding Compute Applications
- SMART Modular Expands DuraMemory™ Offerings with Proprietary DIMM Retention Device for Harsh Operating Environments
- SMART Modular Announces New Memory Solutions for Data Center Networking Applications
This document is provided by Sekorm Platform for VIP exclusive service. The copyright is owned by Sekorm. Without authorization, any medias, websites or individual are not allowed to reprint. When authorizing the reprint, the link of www.sekorm.com must be indicated.
Integrated Circuits
Discrete Components
Connectors & Structural Components
Assembly UnitModules & Accessories
Power Supplies & Power Modules
Electronic Materials
Instrumentation & Test Kit
Electrical Tools & Materials
Mechatronics
Processing & Customization
