Smiths Interconnect Launches The New HR-CTX Series, Offering Excellent Broadband Performance Up to 64GHz
Smiths Interconnect, a leading provider of technically differentiated electronic components, subsystems, microwave and radio frequency products extends its offering of high frequency wire-bondable chip terminations with the release of its new HR-CTX Series, a small, easy-to-implement, high-reliability product qualified for space applications.
HR-CTX
The new HR-CTX high frequency termination Series offers excellent broadband performance up to 64GHz and unrivalled power rating capability up to 5 Watts in a compact 0404 package. Its four times smaller footprint allows customers to save space and weight on the board, while the total thin film design optimized on Aluminum Nitride offers a high power dissipation.
The HR-CTX Series is qualified for space applications, eliminating the need for customer’s inhouse qualifications. It is supplied with all the necessary test and qualification data to ensure flight compliance.
“Our lightweight and very compact termination ensures optimized return loss for multiple frequency bands and a wide array of applications. This allows to use a single chip in multiple applications, reducing the total cost of ownership for our customers”, says Tullio Panarello, VP and General Manager of the Fibre Optics and RF Components Business Unit at Smiths Interconnect.
The new HR-CTX series is a unique solution reducing the bill of material and offering:
·Power rating up to 5 Watts, increased by up to 5x over alternative solutions
·Frequency rating DC to 64 GHz with optimal broad band performance
·Excellent VSWR (1.25:1 Typical)
·Total thin film construction
·Reduced footprint allowing for space and weight savings on the board: 0.040" x 0.040" x 0.015"
·Space qualification based on MIL-PRF-55342
- +1 Like
- Add to Favorites
Recommend
- Smiths Interconnect Acquires Reflex Photonics to Expand in High Speed Data Transmission Market
- How Smiths Interconnect Keeps The Medical World Connected
- Smiths Interconnect Expands into Burn-In Test Market with Acquisition of Plastronics
- Smiths Interconnect Expanded RF Filter Capability for European and Asian Markets
- Smiths Interconnect’s cPCI launched on NASA Mars Perseverance Rover – Interconnect Product of the Year
- Smiths Interconnect NXS Series, New Ultra-High Density, Space Qualified Interconnect
- Smiths Interconnect Deliver A New Highly Integrated Multi-channel Subsystem
- Smiths Interconnect Launches K-band Passive Components for Space Applications
This document is provided by Sekorm Platform for VIP exclusive service. The copyright is owned by Sekorm. Without authorization, any medias, websites or individual are not allowed to reprint. When authorizing the reprint, the link of www.sekorm.com must be indicated.