Ceramic Sandwich, Dual-In-Line Thin Film Resistor, Through Hole Network (Custom) CSD
●A dual-in-line monolithic ceramic package in a variety of sizes and configurations. A rugged, low cost packaging technique with 4 leads to 20 leads that allows higher resistance integration than chip and wire ceramic packages.
●FEATURES
■Gold-to-gold terminations. External leads are attached directly to gold pads on the ceramic substrate by thermo-compression bonding (no internal solder)
■ Monolithic construction
■Ceramic package with no cavity. 4 pins to 20 pins.
■ Flexibility of lead variations to save PC board space
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CSD 、 CSD1xx-xxxUF 、 1xx-xxx 、 1xx-xxx-x |
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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02-Feb-16 |
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Revision: 02-Feb-16 |
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60046 |
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166 KB |
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