HOW TO SELECT A HEAT SINK
With the increase in heat dissipation from microelec-tronic devices and the reduction in overall form factors,thermal management bmomes a more and more impor-tant element of electronic product design. Both the per-formance reliability and life expectancy of electronic equip-ment are inversely related to the component temperatureof the equipment. The relationship between the reliability yand the operating temperature of a typical silicon semi-conductor device shows that a reduction in the tempera-ture corresponds to an exponential increase in the reliabil-ity and life expectancy of the device. Therefore, long lifeand reliable performance of a component may be achievedby effectively controlling the device operating temperaturewithin the imits set by the device design engineers.
Heat sinks are devices that enhance heat dissipationfrom a hot surface, usually the case of a heat generating component, to a cooler ambient, usually air. For the following discussions, air is assumed to be the cooling fluid. Inmost situations, heat transfer across the interface bet weenthe solid surface and the coolant air is the lead efficientwithin the system, and the solid-air interface representsthe greatest barrier for heat dissipation. A heat sink low-ers this barrier mainly by increasing the surface area thatis in direct contact with the coolant. This allows moreheat to be dissipated and/or lowers the device operating temperature.The primary purpose of a heat sink is tomaintain the device temperature below the maximum allowable temperature specified by the device manufacturer.
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Application note & Design Guide |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2018/01/17 |
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201 KB |
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